Diff
checker
Texte
Texte
Images
Documents
Excel
Dossiers
Legal
Enterprise
Application de bureau
Prix
Se connecter
Télécharger Diffchecker Desktop
Comparer le texte
Trouver la différence entre deux fichiers texte
Outils
Historique
Affichage
Vue
Divisé
Unifié
Éditeur live
Masquer les espaces
Cacher identiques
Sans retour à la ligne
Niveau de précision
Intelligent
Syntaxe
Aucun
Modifier l’apparence
Traitement
Ignorer
Transformer le texte
Aller au premier écart
Modifier l'entrée
Diffchecker Desktop
La façon la plus sécurisée d'utiliser Diffchecker. Obtenez l'application Diffchecker Desktop : vos diffs ne quittent jamais votre ordinateur !
Obtenir Desktop
RAM Check
Créé
il y a 6 ans
Le diff n'expire jamais
Effacer
Exporter
Partager
Expliquer
22 suppressions
Lignes
Total
Supprimé
Caractères
Total
Supprimé
Pour continuer à utiliser cette fonctionnalité, passez à
Diff
checker
Pro
Voir les prix
84 lignes
Copier tout
21 ajouts
Lignes
Total
Ajouté
Caractères
Total
Ajouté
Pour continuer à utiliser cette fonctionnalité, passez à
Diff
checker
Pro
Voir les prix
84 lignes
Copier tout
General Module Information
General Module Information
Copier
Copié
Copier
Copié
Module Number:
2
Module Number:
1
Module Size: 8 GBytes
Module Size: 8 GBytes
Memory Type: DDR3 SDRAM
Memory Type: DDR3 SDRAM
Module Type: Unbuffered DIMM (UDIMM)
Module Type: Unbuffered DIMM (UDIMM)
Memory Speed: 800.0 MHz (DDR3-1600 / PC3-12800)
Memory Speed: 800.0 MHz (DDR3-1600 / PC3-12800)
Module Manufacturer: Corsair
Module Manufacturer: Corsair
Copier
Copié
Copier
Copié
Module Part Number: CM
Z
16GX3M2A1600C10
Module Part Number: CM
L
16GX3M2A1600C10
Module Revision: 0
Module Revision: 0
Module Serial Number: 0
Module Serial Number: 0
Copier
Copié
Copier
Copié
Module Manufacturing Date: Year: 200
0
, Week:
0
Module Manufacturing Date: Year: 200
c
, Week:
1e
Module Manufacturing Location: 1
Module Manufacturing Location: 1
SDRAM Manufacturer: Unknown
SDRAM Manufacturer: Unknown
Error Check/Correction: None
Error Check/Correction: None
Module characteristics
Module characteristics
Row Address Bits: 16
Row Address Bits: 16
Column Address Bits: 10
Column Address Bits: 10
Number Of Banks: 8
Number Of Banks: 8
Module Density: 4096 Mb
Module Density: 4096 Mb
Number Of Ranks: 2
Number Of Ranks: 2
Device Width: 8 bits
Device Width: 8 bits
Bus Width: 64 bits
Bus Width: 64 bits
Module Nominal Voltage (VDD): 1.5 V
Module Nominal Voltage (VDD): 1.5 V
Module timing
Module timing
Copier
Copié
Copier
Copié
Minimum SDRAM Cycle Time (tCKmin): 1.
250
ns
Minimum SDRAM Cycle Time (tCKmin): 1.
500
ns
CAS# Latencies Supported:
6,
7
, 9
, 10
CAS# Latencies Supported:
5,
6,
8
, 9
Minimum CAS# Latency Time (tAAmin):
12.500
ns
Minimum CAS# Latency Time (tAAmin):
13.125
ns
Minimum RAS# to CAS# Delay (tRCDmin):
12.500
ns
Minimum RAS# to CAS# Delay (tRCDmin):
13.125
ns
Minimum Row Precharge Time (tRPmin):
12.500
ns
Minimum Row Precharge Time (tRPmin):
13.125
ns
Minimum Active to Precharge Time (tRASmin):
33.750
ns
Minimum Active to Precharge Time (tRASmin):
36.000
ns
Copier
Copié
Copier
Copié
Supported Module Timing at 800.0 MHz: 10-10-10-27
Supported Module Timing at 666.7 MHz: 9-9-9-
24
Supported Module Timing at 666.7 MHz: 9-9-9-
23
Supported Module Timing at
400.0 MHz: 6-6-6-15
Supported Module Timing at
533
.3 MHz:
7-7-7-18
Supported Module Timing at 333
.3 MHz:
5-5-5-12
Minimum Write Recovery Time (tWRmin): 15.000 ns
Minimum Write Recovery Time (tWRmin): 15.000 ns
Minimum Row Active to Row Active Delay (tRRDmin): 6.000 ns
Minimum Row Active to Row Active Delay (tRRDmin): 6.000 ns
Copier
Copié
Copier
Copié
Minimum Active to Active/Refresh Time (tRCmin):
48
.125 ns
Minimum Active to Active/Refresh Time (tRCmin):
49
.125 ns
Minimum Refresh Recovery Time Delay (tRFCmin):
260
.000 ns
Minimum Refresh Recovery Time Delay (tRFCmin):
300
.000 ns
Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
Minimum Four Activate Window Delay Time (tFAWmin): 30.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 30.000 ns
Features
Features
Partial Array Self Refresh (PASR): Supported
Partial Array Self Refresh (PASR): Supported
On-die Thermal Sensor (ODTS) Readout: Not Supported
On-die Thermal Sensor (ODTS) Readout: Not Supported
Auto Self Refresh (ASR): Not Supported
Auto Self Refresh (ASR): Not Supported
Extended Temperature 1X Refresh Rate: Not Supported
Extended Temperature 1X Refresh Rate: Not Supported
Extended Temperature Range: Supported
Extended Temperature Range: Supported
Module Temperature Sensor: Not Supported
Module Temperature Sensor: Not Supported
Pseudo Target Row Refresh (pTRR): Not Supported
Pseudo Target Row Refresh (pTRR): Not Supported
Module Nominal Height: 29 - 30 mm
Module Nominal Height: 29 - 30 mm
Module Maximum Thickness (Front): 2 - 3 mm
Module Maximum Thickness (Front): 2 - 3 mm
Module Maximum Thickness (Back): 2 - 3 mm
Module Maximum Thickness (Back): 2 - 3 mm
Intel Extreme Memory Profile (XMP)
Intel Extreme Memory Profile (XMP)
XMP Revision: 1.3
XMP Revision: 1.3
Enthusiast / Certified Profile [Enabled]
Enthusiast / Certified Profile [Enabled]
Module VDD Voltage Level: 1.50 V
Module VDD Voltage Level: 1.50 V
Memory Controller Voltage Level: 1.20 V
Memory Controller Voltage Level: 1.20 V
CAS# Latencies Supported: 6, 10
CAS# Latencies Supported: 6, 10
Minimum SDRAM Cycle Time (tCKmin): 1.250 ns (800.0 MHz)
Minimum SDRAM Cycle Time (tCKmin): 1.250 ns (800.0 MHz)
Minimum CAS Latency Time (tAAmin): 12.500 ns
Minimum CAS Latency Time (tAAmin): 12.500 ns
Minimum RAS# to CAS# Delay Time (tRCDmin): 12.500 ns
Minimum RAS# to CAS# Delay Time (tRCDmin): 12.500 ns
Minimum Row Precharge Delay Time (tRPmin): 12.500 ns
Minimum Row Precharge Delay Time (tRPmin): 12.500 ns
Minimum Active to Precharge Delay Time (tRASmin): 33.750 ns
Minimum Active to Precharge Delay Time (tRASmin): 33.750 ns
Minimum CAS Write Latency Time (tCWLmin): 10.000 ns
Minimum CAS Write Latency Time (tCWLmin): 10.000 ns
Copier
Copié
Copier
Copié
Minimum Write Recovery Time (tWRmin):
15.000
ns
Minimum Write Recovery Time (tWRmin):
28.750
ns
Minimum Active to Active/Refresh Delay Time (tRCmin):
50.625
ns
Minimum Active to Active/Refresh Delay Time (tRCmin):
46.250
ns
Maximum tREFI Time (Average Periodic Refresh Interval): 7.750 us
Maximum tREFI Time (Average Periodic Refresh Interval): 7.750 us
Minimum Refresh Recovery Delay Time (tRFCmin): 260.000 ns
Minimum Refresh Recovery Delay Time (tRFCmin): 260.000 ns
Minimum Internal Read to Precharge Command Delay Time (tRTPmin): 7.500 ns
Minimum Internal Read to Precharge Command Delay Time (tRTPmin): 7.500 ns
Copier
Copié
Copier
Copié
Minimum Row Active to Row Active Delay Time (tRRDmin):
7.500
ns
Minimum Row Active to Row Active Delay Time (tRRDmin):
6.250
ns
Minimum Four Activate Window Delay Time (tFAWmin):
37.5
ns
Minimum Four Activate Window Delay Time (tFAWmin):
30.0
ns
Minimum Internal Write to Read Command Delay Time (tWTRmin): 7.500 ns
Minimum Internal Write to Read Command Delay Time (tWTRmin): 7.500 ns
Supported Module Timing at 800.0 MHz: 10-10-10-27
Supported Module Timing at 800.0 MHz: 10-10-10-27
Read to Write CMD Turn-around Time Optimization: No adjustment
Read to Write CMD Turn-around Time Optimization: No adjustment
Write to Read CMD Turn-around Time Optimization: No adjustment
Write to Read CMD Turn-around Time Optimization: No adjustment
Back 2 Back CMD Turn-around Time Optimization: No adjustment
Back 2 Back CMD Turn-around Time Optimization: No adjustment
System Command Rate Mode: 2N
System Command Rate Mode: 2N
Différences enregistrées
Texte d'origine
Ouvrir un fichier
General Module Information Module Number: 2 Module Size: 8 GBytes Memory Type: DDR3 SDRAM Module Type: Unbuffered DIMM (UDIMM) Memory Speed: 800.0 MHz (DDR3-1600 / PC3-12800) Module Manufacturer: Corsair Module Part Number: CMZ16GX3M2A1600C10 Module Revision: 0 Module Serial Number: 0 Module Manufacturing Date: Year: 2000, Week: 0 Module Manufacturing Location: 1 SDRAM Manufacturer: Unknown Error Check/Correction: None Module characteristics Row Address Bits: 16 Column Address Bits: 10 Number Of Banks: 8 Module Density: 4096 Mb Number Of Ranks: 2 Device Width: 8 bits Bus Width: 64 bits Module Nominal Voltage (VDD): 1.5 V Module timing Minimum SDRAM Cycle Time (tCKmin): 1.250 ns CAS# Latencies Supported: 6, 7, 9, 10 Minimum CAS# Latency Time (tAAmin): 12.500 ns Minimum RAS# to CAS# Delay (tRCDmin): 12.500 ns Minimum Row Precharge Time (tRPmin): 12.500 ns Minimum Active to Precharge Time (tRASmin): 33.750 ns Supported Module Timing at 800.0 MHz: 10-10-10-27 Supported Module Timing at 666.7 MHz: 9-9-9-23 Supported Module Timing at 533.3 MHz: 7-7-7-18 Minimum Write Recovery Time (tWRmin): 15.000 ns Minimum Row Active to Row Active Delay (tRRDmin): 6.000 ns Minimum Active to Active/Refresh Time (tRCmin): 48.125 ns Minimum Refresh Recovery Time Delay (tRFCmin): 260.000 ns Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns Minimum Four Activate Window Delay Time (tFAWmin): 30.000 ns Features Partial Array Self Refresh (PASR): Supported On-die Thermal Sensor (ODTS) Readout: Not Supported Auto Self Refresh (ASR): Not Supported Extended Temperature 1X Refresh Rate: Not Supported Extended Temperature Range: Supported Module Temperature Sensor: Not Supported Pseudo Target Row Refresh (pTRR): Not Supported Module Nominal Height: 29 - 30 mm Module Maximum Thickness (Front): 2 - 3 mm Module Maximum Thickness (Back): 2 - 3 mm Intel Extreme Memory Profile (XMP) XMP Revision: 1.3 Enthusiast / Certified Profile [Enabled] Module VDD Voltage Level: 1.50 V Memory Controller Voltage Level: 1.20 V CAS# Latencies Supported: 6, 10 Minimum SDRAM Cycle Time (tCKmin): 1.250 ns (800.0 MHz) Minimum CAS Latency Time (tAAmin): 12.500 ns Minimum RAS# to CAS# Delay Time (tRCDmin): 12.500 ns Minimum Row Precharge Delay Time (tRPmin): 12.500 ns Minimum Active to Precharge Delay Time (tRASmin): 33.750 ns Minimum CAS Write Latency Time (tCWLmin): 10.000 ns Minimum Write Recovery Time (tWRmin): 15.000 ns Minimum Active to Active/Refresh Delay Time (tRCmin): 50.625 ns Maximum tREFI Time (Average Periodic Refresh Interval): 7.750 us Minimum Refresh Recovery Delay Time (tRFCmin): 260.000 ns Minimum Internal Read to Precharge Command Delay Time (tRTPmin): 7.500 ns Minimum Row Active to Row Active Delay Time (tRRDmin): 7.500 ns Minimum Four Activate Window Delay Time (tFAWmin): 37.5 ns Minimum Internal Write to Read Command Delay Time (tWTRmin): 7.500 ns Supported Module Timing at 800.0 MHz: 10-10-10-27 Read to Write CMD Turn-around Time Optimization: No adjustment Write to Read CMD Turn-around Time Optimization: No adjustment Back 2 Back CMD Turn-around Time Optimization: No adjustment System Command Rate Mode: 2N
Texte modifié
Ouvrir un fichier
General Module Information Module Number: 1 Module Size: 8 GBytes Memory Type: DDR3 SDRAM Module Type: Unbuffered DIMM (UDIMM) Memory Speed: 800.0 MHz (DDR3-1600 / PC3-12800) Module Manufacturer: Corsair Module Part Number: CML16GX3M2A1600C10 Module Revision: 0 Module Serial Number: 0 Module Manufacturing Date: Year: 200c, Week: 1e Module Manufacturing Location: 1 SDRAM Manufacturer: Unknown Error Check/Correction: None Module characteristics Row Address Bits: 16 Column Address Bits: 10 Number Of Banks: 8 Module Density: 4096 Mb Number Of Ranks: 2 Device Width: 8 bits Bus Width: 64 bits Module Nominal Voltage (VDD): 1.5 V Module timing Minimum SDRAM Cycle Time (tCKmin): 1.500 ns CAS# Latencies Supported: 5, 6, 8, 9 Minimum CAS# Latency Time (tAAmin): 13.125 ns Minimum RAS# to CAS# Delay (tRCDmin): 13.125 ns Minimum Row Precharge Time (tRPmin): 13.125 ns Minimum Active to Precharge Time (tRASmin): 36.000 ns Supported Module Timing at 666.7 MHz: 9-9-9-24 Supported Module Timing at 400.0 MHz: 6-6-6-15 Supported Module Timing at 333.3 MHz: 5-5-5-12 Minimum Write Recovery Time (tWRmin): 15.000 ns Minimum Row Active to Row Active Delay (tRRDmin): 6.000 ns Minimum Active to Active/Refresh Time (tRCmin): 49.125 ns Minimum Refresh Recovery Time Delay (tRFCmin): 300.000 ns Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns Minimum Four Activate Window Delay Time (tFAWmin): 30.000 ns Features Partial Array Self Refresh (PASR): Supported On-die Thermal Sensor (ODTS) Readout: Not Supported Auto Self Refresh (ASR): Not Supported Extended Temperature 1X Refresh Rate: Not Supported Extended Temperature Range: Supported Module Temperature Sensor: Not Supported Pseudo Target Row Refresh (pTRR): Not Supported Module Nominal Height: 29 - 30 mm Module Maximum Thickness (Front): 2 - 3 mm Module Maximum Thickness (Back): 2 - 3 mm Intel Extreme Memory Profile (XMP) XMP Revision: 1.3 Enthusiast / Certified Profile [Enabled] Module VDD Voltage Level: 1.50 V Memory Controller Voltage Level: 1.20 V CAS# Latencies Supported: 6, 10 Minimum SDRAM Cycle Time (tCKmin): 1.250 ns (800.0 MHz) Minimum CAS Latency Time (tAAmin): 12.500 ns Minimum RAS# to CAS# Delay Time (tRCDmin): 12.500 ns Minimum Row Precharge Delay Time (tRPmin): 12.500 ns Minimum Active to Precharge Delay Time (tRASmin): 33.750 ns Minimum CAS Write Latency Time (tCWLmin): 10.000 ns Minimum Write Recovery Time (tWRmin): 28.750 ns Minimum Active to Active/Refresh Delay Time (tRCmin): 46.250 ns Maximum tREFI Time (Average Periodic Refresh Interval): 7.750 us Minimum Refresh Recovery Delay Time (tRFCmin): 260.000 ns Minimum Internal Read to Precharge Command Delay Time (tRTPmin): 7.500 ns Minimum Row Active to Row Active Delay Time (tRRDmin): 6.250 ns Minimum Four Activate Window Delay Time (tFAWmin): 30.0 ns Minimum Internal Write to Read Command Delay Time (tWTRmin): 7.500 ns Supported Module Timing at 800.0 MHz: 10-10-10-27 Read to Write CMD Turn-around Time Optimization: No adjustment Write to Read CMD Turn-around Time Optimization: No adjustment Back 2 Back CMD Turn-around Time Optimization: No adjustment System Command Rate Mode: 2N
Trouver la différence